V. SARIHAN, "Energy based methodology for damage and life prediction of solder joints under thermal cycling", IEEE Components and Manufacturing Technology, vol. 17, pp. 626-631, 1994.

V. SARIHAN, "Energy based methodology for damage and life prediction of solder joints under thermal cycling", IEEE Components and Manufacturing Technology, vol. 17, pp. 626-631, 1994. Copyright - [Précédente] [Première page] [Suivante] - Home

Article : [SHEET326]

Titre : V. SARIHAN, Energy based methodology for damage and life prediction of solder joints under thermal cycling, IEEE Components and Manufacturing Technology, vol. 17, pp. 626-631, 1994.

Cité dans : [DATA062] Recherche sur les auteurs COFFIN et MANSON, octobre 2001.
Cité dans : [CONF038] ECTC, Electronic Components and Technology Conference et IEEE Electronic Components and Technology, mars 2004.
Cité dans :[SHEET320] V. SARIHAN, Energy based methodology for damage and life prediction of solder joints under thermal cycling, Proceedings of the 43rd Electronic Components and Technology Conference, 1993, pp. 32-38.
Cité dans :[SHEET321]

Auteur : Sarihan, V - Adv. Packaging Dev. Center, Motorola Inc., Phoenix, AZ, USA

Stockage : Thierry LEQUEU
Lien : SHEET321.HTM#Bibliographie - référence [11].
Lien : private/SARIHAN1.pdf - 444 Ko, 6 pages
Vers : Bibliographie
Source : IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging.
Info : see also Components, Hybrids, and Manufacturing Technology, IEEE Transactions on.
Pages : 626 - 631
Date : Nov. 1994
Volume : 17
Issue : 4
ISSN : 1070-9894
CODEN : IMTBE4

Abstract :
Thermal fatigue of solder joints is critical to electronic
package performance and life considerations. It is also difficult
to predict because of complex time temperature dependence of
solder behavior. Strain based solder fatigue descriptions, like
Coffin-Manson, are not adequate as the fatigue life of the solder
may also be function of stresses. When the relationship between
stress and strain is not unique, which is the case here because
of strain rate dependence, a Coffin-Manson type of strain based
correlation will be valid only over a limited range. A nonlinear
finite element method (FEM) based simulation methodology, has
been developed, for predicting the life of solder joints when
subjected to thermal cycling. This methodology uses a hysteresis
energy based damage function approach for damage and fatigue life
prediction of the solder joint. The nonlinear solder behavior
response inclusive of elastic, time independent plastic and time
dependent viscoplastic response is accounted for. The methodology
has been used for correlating the fatigue life of flip chip
package designs with silicon die, alumina substrate and 95Pb5%Sn
peripheral bumps subjected to thermal cycling. Two different bump
designs and six temperature cycles with different ramp and dwell
times were used from the literature to correlate the life
prediction methodology with experimentally determined mean cycles
to failure. A multiple cycle response was simulated to determine
the stable cycle response. The observed correlation between the
hysteresis energy based damage function and experimentally
determined fatigue life is extremely encouraging.

Subject_terms :
life testing; soldering; thermal stress cracking; thermal
stresses; integrated circuit packaging; finite element analysis;
integrated circuit reliability; flip-chip devices; damage
prediction; life prediction; solder joints; thermal cycling;
thermal fatigue; electronic package performance; complex time
temperature dependence; nonlinear finite element method;
hysteresis energy based damage function; nonlinear solder
behavior response; time independent plastic response; time
dependent viscoplastic response; flip chip package designs;
silicon die; alumina substrate; 95Pb5%Sn peripheral bumps; ramp
times; dwell times; mean cycles to failure; multiple cycle
response; PbSn

Accession_Number : 4859746

Bibliographie

References : 21
[1] : L.F. Coffin, "Predictive Parameters and their Application to High Temperature Low-Cycle Fatigue," Fracture 1969 (Proc. 2d. Int. Conference on Fracture), London, Chapman and Hall, 1969, p. 643.
[2] : S.S. Manson, "Interfaces between Fatigue Creep and Fracture." Int. J. of Fracture Mechanics, 2(1), 1966, pp. 327-363.
[3] : H.D. Solomon, "The Creep and Strain Rate Sensitivity of a High Ph Content Solder," AIME symposium on Deformation in Electronic Materials and Devices, Oct. 1989.
[4] : K.C. Norris, A. H. Landzberg, "Reliability of Controlled Collapse Interconnections." IBM J. Res. Develop., vol. 13, p. 266 (1969).
[5] : H.J. Shah and J.H. Kelly, "Effect of Dwell Time on Thermal Cycling of the Flip-Chip Joint", Proceedings International Microelectronics Symposium, pp 341-346, 1970.
[6] : S. Vaynman, S.A. McKeown, "Energy-Based Methodology for the Fatigue-Life Prediction of Solder Materials", 41st Electronics Components Conference, pp 671·515. May 1991.
[7] : H.D. Solomon, "Low-Frequency High Temperature Low-Cycle Fatigue of 60Sn/40Pb Solder", ASTM STP-942. ed. H.D. Solomon, et al., pp 342-369, 1988.
[8] : Y.M. Radhakrishnan, "Damage Accumulation end Fracture Life in High-Temperature Low Cycle Fatigue", in Low Cycle-Fatigue and Life Prediction, ASTM STP 770, pp 135-151. ASTM, 1982.
[9] : R. Subrahmanyan, "A Damage Integral Approach for Low-Cycle Isothermal and Thermal Fatigue", PhD Thessis, Cornell University. 1990.
[10] : J. Morrow, "Cyclic Plastic Energy and Fatigue of Metals", in Internal Friction, Damping, and Cyclic Plasticity, ASTM STP 378, pp. 45-87, ASTM, 1964.
[11] : C.E. Feltner, J. Morrow, "Microplastic Strain Hysteresis Energy as a Criteria for Fatigue Fracture", J. of Basic Engineering, pp. 15-22, 1961.
[12] : W.J. Ostergren, "A Damage Function and Associated Failure Equations for Predicting Hold Time and Frequency Effects in Elevated Temperature. Low Cycle Fatigue" J. of Testing and Evaluation, 4, pp 327-339. 1976
[13] : E.Z. Stowell, "A Study of the Energy Criterion for Fatigue", Nuclear Engineering and Design, 3, pp. 32-40, 1966.
[14] : C.S. Chang, W.T. Pimbley, H.D. Conway, "An Analysis of Metal Fatigue Based on Hysteresis Energy", Experimental Mechanics, pp. 133-137, 1968.
[15] : J.T. Fong, "Energy Approach for Creep Fatigue Interactions in Metals at High Temperatures", J. of Pressure Vessel Technology, no 214 222. 1975.
[16] : V. Sarihan. "Temperatures Dependent Viscoplastic Simulation of Controlled Collapse Solder Joint Under Thermal Cycling", to be Published in Journal of Electronic Packaging, ASME, March 1993
[17] : Hibbit, Carlsson and Sorensen Inc., ABAQUS 1991.
[18] : R. Darveaux, K. Banerji, "Fatigue Analysis of Flip Chip Assemblies using Thermal Stress Simulations and a Coffin-Manson Relation", Proceedings ECTC (1991).
[19] : R. Satoh, K. Arakawa, M. Harada, K. Matsui, "Thermal Fatigue Life of Pb-Sn Alloy Interconnections", IEEE Transactions on Components Hybrids and Manufacturing Technology, vol. 14, no. 1, pp. 224-232, March 1991.
[2O] : D. Stone, H. Wilson. R. Subrahmanyan, and C.-Y. Li, "An investigation of Creep Fatigue Interaction in Solder Joints", Semiconductor Research Corporation publication C86320, Dec. 1986.
[21] : E.C. Cutiongco. S. Vaynman, M.E. Fine, D.A. Jeannotte, "Isothermal Fatigue of 63Sn-37Pb Solder", J. Electronic Packaging, 112, pp. 110-114, 1990.

  [1] : [SHEET327] L.F. Coffin, Predictive Parameters and their Application to High Temperature Low-Cycle Fatigue, Fracture 1969 (Proc. 2d. Int. Conference on Fracture), London, Chapman and Hall, 1969, p. 643-654.
  [2] : [SHEET328] S.S. MANSON, Interfaces between Fatigue Creep and Fracture. Int. J. of Fracture Mechanics, 2(1), 1966, pp. 327-363.
  [3] : [SHEET342] H.D. Solomon, The Creep and Strain Rate Sensitivity of a High Ph Content Solder, AIME symposium on Deformation in Electronic Materials and Devices, Oct. 1989.
  [4] : [SHEET343] K.C. NORRIS, A.H. LANDZBERG, Reliability of Controlled Collapse Interconnections. IBM J. Res. Develop., vol. 13, p. 266 (1969).
  [5] : [SHEET393] H.J. SHAH, J.H. KELLY, Effect of Dwell Time on Thermal Cycling of the Flip-Chip Joint, Proceedings International Microelectronics Symposium, pp 341-346, 1970.

Mise à jour le lundi 10 avril 2023 à 18 h 59 - E-mail : thierry.lequeu@gmail.com
Cette page a été produite par le programme TXT2HTM.EXE, version 10.7.3 du 27 décembre 2018.

Les informations contenues dans cette page sont à usage strict de Thierry LEQUEU et ne doivent être utilisées ou copiées par un tiers.
Powered by www.google.fr, www.e-kart.fr, l'atelier d'Aurélie - Coiffure mixte et barbier, La Boutique Kit Elec Shop and www.lequeu.fr.