P. REY, E. WOIRGARD, J.-M. THEBAUD, C. ZARDINI, "Evaluation of the creep of the Sn62Pb36Ag2 solder alloy by the measurement of the stresses in a silicon die", IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 21, Issue
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Titre : P. REY, E. WOIRGARD, J.-M. THEBAUD, C. ZARDINI, Evaluation of the creep of the Sn62Pb36Ag2 solder alloy by the measurement of the stresses in a silicon die, IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 21, Issue 2, June 1998, pp. 365-372.

Cité dans : [DIV289]  Recherche sur l'auteur Christian ZARDINI, juillet 2004.
Cité dans : [DIV441]  Recherche sur l'auteur Eric WOIRGARD, juillet 2004.
Cité dans :[ART267]
Auteur : Rey, P.
Auteur : Woirgard, E.
Auteur : Thebaud, J.-M.
Auteur : Zardini, C - WEHRLE Autoelektronik GmbH, Waldshut-Tiengen, Germany

Vers : Bibliographie
Lien : ART267.HTM#Bibliographie - référence [3].

Stockage : Thierry LEQUEU
Lien : private/ZARDINI1.pdf - 247 Ko, 8 pages.
Source : Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on [see also Components, Hybrids, and Manufacturing Technology, IEEE Transactions on]
Pages : 365 - 372
Info : this conference was held on 26-30 Oct. 1997
Date : June 1998
Volume : 21
Issue : 2
ISSN : 1070-9886
CODEN : IMTAEZ
Accession_Number : 6011962

Abstract :
The Sn/sub 62/Pb/sub 36/Ag/sub 2/ solder alloy is widely used in
electronic applications. To predict the lifetime and to control
the reliability of power devices, solder creep law must be taken
into account in the thermomechanical finite element simulations.
The creep law used in the simulations must be the most
representative of the real behaviour of the solder joint in its
operating environment. To determine a mathematical model of the
solder creep, silicon stress chips with piezoresistive sensors
are used. These chips are mounted on a substrate so that the
solder joints have the same microstructure as that in an
operating standard power hybrid assembly. Nevertheless the
measurements are made on the top of the silicon chip where are
located the stress sensors, while the solder joint is on the
bottom of the chip. This is why finite element calculations are
necessary to fit the creep within the solder alloy. From these
experimental data, the equivalent stresses at the surface of the
silicon have been calculated. As a result, we have obtained the
evolution in time of the equivalent stresses at the die surface.
In this paper, we show how this experimental curve has been used
in thermomechanical finite element simulations to find a
mathematical model of the creep in the solder. Then this formula
allows for an extrapolation of the behaviour in time of the
solder and then of the hybrid assembly in simulations.

Subject_terms : tin alloys; creep; IMS; stress measurement; silicon die; hybrid assembly; lifetime; reliability; power device; thermomechanical finite element simulation; mathematical model; piezoresistive sensor; Sn/sub 62/Pb/sub 36/Ag/sub 2/ solder alloy; Sn/sub 62/Pb/sub 36/Ag/sub 2/; Si


Bibliographie

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