B. FOUCHER, J. BOULLIE, B. MESLET, D. DAS, "A review of reliability prediction methods for electronic devices", Microelectronics Reliability, Volume 42, Issues 8, pp. 115-1162.
Copyright - [Précédente] [Première page] [Suivante] - Home

Article : [ART294]

Titre : B. FOUCHER, J. BOULLIE, B. MESLET, D. DAS, A review of reliability prediction methods for electronic devices, Microelectronics Reliability, Volume 42, Issues 8, pp. 115-1162.

Cité dans :[REVUE355] Elsevier Science, Microelectronics Reliability, Volume 42, Issue 8, Pages 1153-1248, August 2002.
Auteur : B. Foucher - (a)
Auteur : J. Boullié - (a)
Auteur : B. Meslet - (b)
Auteur : D. Das - (b)

Vers : Bibliographie
Adresse : (a) EADS CCR, 12, rue Pasteur BP76, 92152 Suresnes Cedex, France
Adresse : (b) CALCE Electronic Products and Systems Center, University of Maryland, College Park, MD 20740, USA
Infos : J. Boullié is now with Alcatel Space Industries (Toulouse, France). B. Meslet is now at Yonsei University (Seoul, Korea).
Fax. : +33-1-46-97-30-08
Lien : mailto:bruno.foucher@eads.net
Source : Microelectronics Reliability
Volume : 42
Issues : 8
Date : 2002
Pages : 1155 - 1162
DOI : 10.1016/S0026-2714(02)00087-2
PII : S0026-2714(02)00087-2
Lien : private/FOUCHER1.pdf - 99 Ko, 8 pages.
Switches :
Puissance :
Logiciel :
Stockage :

Abstract :
A wide range of reliability prediction methods is available today for electronic
systems. This article classifies the commonly used and referred to reliability
prediction methodologies into some categories easy to understand. A set of
selected methods, which are of relevance to many industries, the aerospace
industry among others, are reviewed and the possibility they offer to address
the stated objectives is assessed. Their respective advantages and shortcomings
are the basis for the recommendation we make to use the methods in a combined
fashion (simultaneously or successively) along the product development process.

Article Outline
1. Introduction
2. The concepts for reliability prediction
2.1. Bottom¯up statistical methods
2.2. Top¯down similarity analysis methods
2.3. Bottom-up physics-of-failure methods
3. Discussion on the methods
4. Comparison criteria and assessment
5. Management of objectives
6. Conclusions

Table 1. Non-exhaustive list of assessed reliability prediction methods and their latest updates (<1K)
Table 2. Examples of models used in BS methods for microcircuits (<1K)
Table 3. Sources of data and environment of the reliability prediction methods(4K)
Table 4. Inputs to the different reliability prediction methods (10K)
Table 5. Comparison criteria for use (6K)
Table 6. Comparison criteria as management of objectives (<1K)


Bibliographie

TOP

Références : 30
[1] : W. Denson , Rebuttal to: A critique of the Reliability-Analysis-Center failure-rate-model for plastic encapsulated microcircuits. IEEE Trans. Reliab. 47 4 (1998), pp. 419¯424. Abstract-Compendex
[2] : SAE G-11 Committee, Aerospace information report on reliability prediction methodologies for electronic equipment AIR5286, Electronic reliability prediction sub-committee, 31/01/98.
[3] : M. Pecht and A. Ramakrishnan , Development and activities of the IEEE reliability standards group. J. Reliab. Eng. Assoc. Jpn. 22 8 (2000), pp. 699¯706.
[4] : N. Sinnadurai, A. Shukla and M. Pecht , A critique of the Reliability-Analysis-Center failure-rate-model for plastic encapsulated microcircuits. IEEE Trans. Reliab. 47 2 (1998), pp. 110¯113. Abstract-INSPEC | Abstract-Compendex
[5] : J. Bowles , A survey of reliability prediction procedures for microelectronic devices. IEEE Trans. Reliab. 41 1 (1992), pp. 2¯12. Abstract-INSPEC | Abstract-Compendex | Full Text via CrossRef
[6] : C. Leonard , On US Mil-Hdbk-217 and reliability prediction. IEEE Trans. Reliab. 37 (1988), pp. 450¯451.
[7] : C. Leonard , Failure prediction methodology calculations can mislead: use them wisely, not blindly. Proceedings of the National Aerospace and Electronics Conference NAECON 4 (1989), pp. 1248¯1253.
[8] : K.L. Wong , What is wrong with the existing reliability prediction methods?. Qual. Reliab. Eng. Int. 6 4 (1990), pp. 251¯257. Abstract-Compendex | Abstract-INSPEC
[9] : K.L. Wong , A change in direction for reliability engineering is long overdue. IEEE Trans. Reliab. 42 (1993), p. 261.
[10] : United States Department of Defense, US Mil-Hdbk-217. Reliability Prediction of Electronic Equipment, version F, 1995.
[11] : Telcordia Technologies Special Report SR-332, Reliability Prediction Procedure for Electronic Equipment, Issue 1, Telcordia Customer Service, Piscataway, N. J., May 2001.
[12] : Centre National d'Etude des Télécommunications. Handbook of Reliability Data for Electronic Components RDF-93 English Issue, 1993.
[13] : UTEC 80810. Modèle universel pour le calcul de la fiabilité prévisionnelle des composants, cartes et équipements électroniques¯¯RDF2000, (projet du 11/01/00).
[14] : British Telecom, Handbook of Reliability Data, HDR-5, 1995.15. Siemens AG, Siemens Company Standard SN29500, Version 6.0, Failure Rates of Electronic Components, Siemens Technical Liaison and Standardization, 9 November 1999.
[16] : Nippon Telegraph and Telephone Corporation, Standard Reliability Table for Semiconductor Devices, 1985.
[17] : Denson W. A tutorial: PRISM. Reliab Analysis Center 1999;3rd quarter:1¯6.
[18] : L. Gullo , In-service reliability assessment and top-down approach provides alternative reliability prediction method. Ann. Reliab. Maintain. Symp. Proc. (1999), pp. 365¯377. Abstract-Compendex | Abstract-INSPEC
[19] : B. Johnson and L. Gullo , Improvements in reliability assessment and prediction methodology. Ann. Reliab. Maintain. Symp. Proc. (2000), pp. 181¯187. Abstract-INSPEC | Abstract-Compendex
[20] : Internet website www.remm.org/REMM. Last modified 16 February 2001.
[21] : Internet website www.agena.co.uk/tracs. Last modified 11 August 1999.
[22] : Charpenel P et al. An other way to assess electronics part reliability. Microelectronics Reliability, Proceedings ESREF 1997;37(10/11):1449¯1452.
[23] : P. Charpenel, P. Cavernes and V. Casanovas , A new prediction-methodology on avionics embedded electronics: why? how?. Ann. Reliab. Maintain. Symp. Proc. (1999), pp. 378¯382. Abstract-Compendex | Abstract-INSPEC
[24] : M. Osterman and T. Stadterman , Failure assessment software for circuit card assemblies. Ann. Reliab. Maintain. Symp. Proc. (1999), pp. 269¯276. Abstract-Compendex | Abstract-INSPEC
[25] : McCluskey P. Fatigue and intermetallic formation in lead free solder die attach. Proceedings of IPACK'01, The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition, paper #44592, 9¯13 July 2001. p. 1¯7.
[26] : McCluskey P. A web-based graduate course on the mechanical design of high temperature and high power electronics. Proceedings of the electronic component and technology conference, 30 May 2001. p. 397¯400.
[27] : M. Pecht and V. Ramappan , Are components still a major problem? A review of electronic systems and device field failure returns. IEEE Trans. Comp. Hybr. Manufact. Technol. 15 6 (1992), pp. 1160¯1164. Abstract-Compendex | Abstract-INSPEC
[28] : W. Denson , The history of reliability prediction. IEEE Trans. Reliab. 47 3-SP (1998), pp. 321¯328. Abstract-Compendex
[29] : J. Jones and J. Hayes , A comparison of electronic reliability prediction models. IEEE Trans. Reliab. 48 2 (1999), pp. 127¯134. Abstract-INSPEC | Abstract-Compendex
[30] : M.G. Pecht, A.A. Shukla, N. Kelkar and J. Pecht , Criteria for the assessment of reliability models. IEEE Trans. Comp. Packag. Manufact. Technol. B 20 3 (1997), pp. 229¯233.

  [1] :  [ART525]  K.L. WONG, What is wrong with the existing reliability prediction methods?, Quality and Reliability Engineering International, Vol. 6, No 4, 1990, pp. 251-257.


Mise à jour le lundi 10 avril 2023 à 18 h 46 - E-mail : thierry.lequeu@gmail.com
Cette page a été produite par le programme TXT2HTM.EXE, version 10.7.3 du 27 décembre 2018.

Copyright 2023 : TOP

Les informations contenues dans cette page sont à usage strict de Thierry LEQUEU et ne doivent être utilisées ou copiées par un tiers.
Powered by www.google.fr, www.e-kart.fr, l'atelier d'Aurélie - Coiffure mixte et barbier, La Boutique Kit Elec Shop and www.lequeu.fr.