U. SCHEUERMANN, U. HECHT, "Power Cycling Lifetime of Advanced Power Modulesfor Different Temperature Swings", Proc. PCIM, PE4.5, 59-64, Nürnberg 2002.
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Article : [ART280]

Titre : U. SCHEUERMANN, U. HECHT, Power Cycling Lifetime of Advanced Power Modulesfor Different Temperature Swings, Proc. PCIM, PE4.5, 59-64, Nürnberg 2002.

Cité dans : [CONF010] PCIM, POWER CONVERSION CONFERENCE & INTELLIGENT MOTION, ZM Communications Gmbh, septembre 2009.
Auteur : U. Scheuermann
Auteur : U. Hecht - SEMIKRON International

Adresse : SEMIKRON Elektronik GmbH, Sigmundstraße 200, 90431 Nuremberg, Germany
Tel. : ++49-911-6559-381
Fax. : ++49-911-6559-414
Lien : "mailto:uwe.scheuermann@semikron.com"
Site : http://www.semikron.com/
Site : http://www.semikron.com/seminew/entwicke.html
Source : Proc. PCIM, PE4.5
Pages : 59 - 64
Lieu : Nürnberg
Date : 2002
Source : Scheuermann2.pdf - 06/2002 (PDF: 1,5MB)

Abstract:
Exact module lifetime prediction requires a statistical approach for the qualification of modules in end-of-
life tests. This demand can be met by a Weibull analysis of a group of samples. The results for
active power cycling tests, presented here for advanced power modules without base plate, prove the
quality of the design and process capability by a narrow distribution of end-of-life failures. The test
results for junction temperature swings of 80K and 110K can be used as a basis to investigate the
superposition of the both conditions. The validity of the linear superposition of accumulated stress is of
great importance for the transfer of lifetime test results to application-conform complex load profiles.
temperature [° C]

Bibliographie

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REFERENCES : 5
[1] : G.Coquery, S.Carubelli, J.P.Ousten, R.Lallemand, F.Lecoq, D.Lhotellier, V.deViry, Ph.Dupuy: Power module lifetime estimation from chip temperature direct measurement in an automotive traction inverter, Microelectronics Reliability 41, 9-10 (2001), 1695-1700.
[2] : H.Berg, E.Wolfgang: Advanced IGBT modules for railway traction applications: Reliability testing, Microelectronics Reliability 38, 6-8 (1998), 1319-1323.
[3] : U.Scheuermann, E.Herr: A Novel Power Module Design and Technology for Improved Power Cycling Capability, Microelectronic Reliability 41, 9-10 (2001), 1713-1718.
[4] : M.Held, P.Jacob, G.Nicoletti, P.Scacco, M.H.Poech, Fast Power Cycling Test for IGBT Modules in Traction Application, Proc. Power Electronics and Drive Systems 1997, 425-430.
[5] : E.Herr, S.Dewar: LoPak IGBT Modules - Inverter Reliability Benefits, Proc. PCIM, Boston (2000).
  [1] :  [PAP372]  G. COQUERY, S. CARUBELLI, J.P. OUSTEN, R. LALLEMAND, F. LECOQ, D. LHOTELLIER, V. DE VIRY, PH. DUPUY, Power module lifetime estimation from chip temperature direct measurement in an automotive traction inverter, ESREF'2001, pp. 1695-1700
  [2] :  [PAP401]  H. BERG, E. WOLFGANG, Advanced IGBT modules for railway traction applications: Reliability testing, Microelectronics Reliability, Volume 38, Issues 6-8, 8 June 1998, pp. 1319-1323.
  [3] :  [ART181]  U. SCHEUERMANN, E. HERR, A Novel Power Module Design and Technology for Improved Power Cycling Capability, ESREF'2001.
  [4] :  [ART258]  M. HELD, P. JACOB, G. NICOLETTI, P. SCACCO, M.-H. POECH, Fast Power Cycling Test for IGBT Modules in Traction Application, Proc. PEDS 97, 1997 , pp. 425-430.
  [5] :  [PAP158]  -------

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